Using Q-YIELD™ (Page 3 of 4)
14 seconds later you have your answer:
(Click image to enlarge)
It appears that a combination of the rcn and bvrcn
parameters could account for 89% of the cases where there
are greater than 200 failures on a wafer. You double click
on the rule to get more information:
(Click image to enlarge)
It appears that high failure rates are three times more
likely when rcn > 21.42 and bvrcn <= 15.94. Although
this does not entirely explain all the cases where there
were a high number of failures, looking at the contingency
table it is clear that it could explain a large proportion
of the cases.
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